Prominent: Conferences and publications
In Autumn 2014, Prominent has been present at several conferences:
• 5th Electronics System-Integration Technology Conference (ESTC 2014), Helsinki, Finland on September 16-18, 2014: Presentation.
• 11th International Wafer-Level Packaging Conference (IWLPC), San Jose, CA on November 11-13, 2014: Abstract of the Presentation.
• European Nanoelectronics Forum 2014, Cannes, France on November 26-27, 2014: Poster.
In addition, the following publication was produced:
• “3D MEMS Wafer Level Packaging Exemplified by RF Characterized TSVs & TGVs and Integration of Bonding Processes”, in proceedings of Int. Wafer-Level Packaging Conference (IWLPC), November 11-13, 2014, San Jose, CA, USA; P. Ågren, T. Ebefors, J. Liljeholm, N. Svedin, Z. Baghchehsaraei, P de Veen
Information about all the conferences and other publicity is available on the Prominent website.