”High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires” in IEEE Transactions on Components, Packaging and Manufacturing Technology 5, 21 (2015) by S.J. Bleiker, A.C. Fischer, U. Shah, N. Somjit, T. Haraldsson, N. Roxhed, J. Oberhammer. G. Stemme, and F. Niklaus.
In this paper, we demonstrate a novel manufacturing technology for high-aspect-ratio vertical interconnects for high-frequency applications for frequencies of up to 75 GHz. The manufacturing approach is based on magnetic assembly of gold-coated nickel wires that are subsequently insulated with a low-k thermosetting polymer. As compared with conventional TSV designs, this novel concept offers a more compact design and a simpler, potentially more cost-effective manufacturing process. Moreover, this fabrication concept is very versatile and adaptable to many different applications, such as interposer, micro electromechanical systems, or millimeter wave applications. For evaluation purposes, coplanar waveguides with incorporated TSV interconnections were fabricated and characterized.