Press & Conferences

Conferences

6th Electronics System-integration Technology Conference ESTC, Grenoble, France on September 13-16, 2016.

the XVIIth International Congress on Rheology (ICR2016), Kyoto, Japan on Aug 8-13, 2016: An oral presentation with the title “Characterization of Jetting Fluids Using Piezorheometry”.

Workshop om elektronik, optoelektronik och sensorer, Kista, Sweden on June 14, 2016: An invited oral presentation with the title ”MEMS development activities at SILEX” and a poster.

2016 IMAPS Nordic conference, Tønsberg, Norway on June 5-7, 2016: An oral presentation with the title ”Jetprinting of solder paste for balling of metalized through silicon via interposers”.

IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, Nevada USA on May 31–June 3, 2016: An oral presentation with the title ”Implementation of Keep-Out-Zones to protect Sensitive Sensor Areas during Backend Processing in Wafer Level Packaging Technology”.

Micronano System Workshop MSW 2016, Lund, Sweden on May 17-18, 2016: Poster.

Printed Electronics Europe 2016, Berlin, Germany on April 27-28, 2016: Silex gave a Masterclass presentation MC2.

IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS), 2016, Shanghai, China on January 24-28, 2016: Poster.

IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS), 2016, Shanghai, China on January 24-28, 2016: Poster.

European Nanoelectronics Forum 2015, Berlin, Germany on December 1-2, 2015: Poster.

Exhibition at Printed Electronics 2015 -conference, Santa Clara, USA on November 18-19 2015: Booth (R33)

SEMICON Europa 2015, Dresden, Germany on October 6-8, 2015: An oral presentation.

6th International Scientific Conference on Print and Media Technology – Printing future days 2015, Chemnitz, Germany on October 5-7, 2015: A proceedings paper of the oral presentation.

MEMS Manufacturing 2015, Santa Clara, CA, USA on August 5-6, 2015: An oral presentation with the title ”Overview of TSV Processes for MEMS Applications.”

IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, San Diego, CA, USA on May 26-29, 2015: Abstract of the oral presentation, Abstract of the oral presentation.

the 7th International Exhibition and Conference for Printed Electronics LOPEC, München, Germany on March 3-5, 2015: Poster.

Micro-plasmas at atmospheric pressure, Eindhoven, the Netherlands on December 10-11, 2014: Presentation.

European Nanoelectronics Forum 2014, Cannes, France on November 26-27, 2014: Poster.

11th International Wafer-Level Packaging Conference (IWLPC), San Jose, CA on November 11-13, 2014: Abstract of the Presentation.

5th Electronics System-Integration Technology Conference (ESTC 2014), Helsinki, Finland on September 16-18, 2014: Abstract of the oral presentation.

28th International Conference on Surface Modification Technologies, Tampere, Finland on June 16-18, 2014: Presentation. The presentation was awarded as the best paper in the conference.

64th ECTC (IEEE Electronic Components and Technology Conference), Orlando, FL, USA on May 27-30, 2014: Poster.

WaferBond’13, Stockholm, Sweden on December 5-6, 2013: Presentation.

Publications

“Fabrication and electrical characterization of partially metallized vias fabricated by inkjet” in Journal of Micromechanics and Microengineering 26, 045017 (2016), by B. Khorramdel and M. Mäntysalo.

“Wide temperature range through silicon vias made of Invar and spin-on glass for interposers and MEMS,” in Proceedings of IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS), 2016, pages 585-588, by M. J. Laakso, M. Asiatici, A. C. Fischer, G. Stemme, and F. Niklaus.

“High-speed metal-filling of through-silicon vias (TSVs) by parallelized magnetic assembly of micro-wires” in Proceedings of IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS), 2016, pages 577-580, by S. J. Bleiker, A. C. Fischer, and F. Niklaus.

”Laser sintering of copper nanoparticles on top of silicon substrates” in Nanotechnology 27, 035203 (2016), by A. Soltani, B. Khorramdel Vahed, A. Mardoukhi, and M. Mäntysalo.

”Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS” by Andreas C. Fischer, Matti Mäntysalo, and Frank Niklaus in Handbook of Silicon Based MEMS Materials and Technologies (Second Edition) edited by Markku Tilli, Teruaki Motooka, Veli-Matti Airaksinen, Sami Franssila, Mervi Paulasto-Kröckel, and Veikko Lindroos (Elsevier, 2015).

”Thermal Modeling for Sintering of Inkjet-Printed Metallic Structures” in Proceedings of 6th International Scientific Conference on Print and Media Technology – Printing future days 2015, pages 133 – 137, by J. Niittynen, T. Kankkunen, M. Mäntysalo.

”Metallization of high density TSVs using super inkjet technology” in Proceedings of IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pages 41-45, by Behnam Khorramdel, Mika-Matti Laurila & Matti Mäntysalo.

”Inkjet printed single layer high-density circuitry for a MEMS device” in Proceedings of IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pages 968-972, by Mika-Matti Laurila, Ayat Soltani, & Matti Mäntysalo.

”Through Substrate Vias: Overview of Processes and Applications”, a whitepaper in MEMS Journal, 11 March 2015 by Silex Microsystems.

”Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers” in Scientific Reports 5, 8832 (2015), by Juha Niittynen, Enrico Sowade, Hyunkyoo Kang, Reinhard R. Baumann & Matti Mäntysalo.

”High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires” in IEEE Transactions on Components, Packaging and Manufacturing Technology 5, 21 (2015) by S.J. Bleiker, A.C. Fischer, U. Shah, N. Somjit, T. Haraldsson, N. Roxhed, J. Oberhammer. G. Stemme, and F. Niklaus.

“3D MEMS Wafer Level Packaging Exemplified by RF Characterized TSVs & TGVs and Integration of Bonding Processes”, in Proceedings of Int. Wafer-Level Packaging Conference (IWLPC), November 11-13, 2014, San Jose, CA, USA, by P. Ågren, T. Ebefors, J. Liljeholm, N. Svedin, Z. Baghchehsaraei, P de Veen.

”Inkjet Filling of TSVs with Silver Nanoparticle Ink”, In Proceedings of Electronic System and Technology Conference (ESTC), Helsinki, Finland, Sept. 16-18, 2014, by Behnam Khorramdel and Matti Mäntysalo.

”Digital printing with micro plasmas and its effects on surface wettability”, in Proceedings of 28th International Conference on Surface Modification Technologies, Tampere, Finland, 2014 by Peter Verhoeven, Alquin Stevens, Jean-Paul Schalken, Ayat Soltani, and Matti Mäntysalo.

“Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer” in Proceedings of 64th Electronic Components and Technology Conference (ECTC), 2014, FL, USA, pp. 1685 – 1689, by Ayat Soltani, Tero Kumpulainen, and Matti Mäntysalo.

Patents

WO2015119564 ”Controlling pressure in cavities on substrates.”

Theses

”Super Inkjet Printed Redistribution Layer for a MEMS Device”, Master of Science thesis,Tampere University of Technology by Mika-Matti Laurila. Issued on December 9, 2015.

”Comparison of Sintering Methods and Conductive Adhesives for Interconnections in Inkjet-Printed Flexible Electronics”, Doctor of Science thesis, Tampere University of Technology by Juha Niittynen. Defended on April 24, 2015.

”Development of Through Glass Vias (TGVs) for Interposer Applications” Master of Science thesis, KTH by Vlad Viorel Cornean. Defended on December 11, 2014. Abstract.

”The rheological characterization of jetting fluids at high shear rates using a piezo axial vibrator”, Master of Science thesis, KTH by O. Rosén. Presented on June 10, 2014.

Press releases

SILEX Microsystems AB press release, May 13, 2013

Spinverse Oy press release, May 13, 2013

Media coverage

”Okmetic sai puoli kuuta taivaalta” in ’Tekniikka ja Talous’, June 23, 2016

”Mustesuihku tekee piikiekon” in ’Tekniikka ja Talous’, May 31, 2013

”Uusi tekniikka nopeuttaa anturivalmistusta” in 3T, May 17, 2013

”Silex joins ENIAC project to develop new solutions for TSV and wafer bonding” in I-Micronews, May 15, 2013

”Silex Partners in ENIAC Processes for MEMS by Inkjet Enhanced Technologies Program” in ’AtoZ Nano’, May 14, 2013

”Silex joins ENIAC project PROMINENT to develop flexible inkjet technologies to MEMS manufacturing process” in ’Display Plus’, May 14, 2013

”Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing” in Nanowerk, May 14, 2013

”Silex Microsystems deltar i stort EU-projekt” in ’Elektronik i Nordern’, May 14, 2013

”Okmetic johtaa EU:n isoa anturitutkimushanketta” in Kauppalehti, May 14, 2013

”Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process” in I-Micronews, May 14, 2013

”Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process” in ’IT News Online’, May 13, 2013

”Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process” in ’IT news’, May 13, 2013

”Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process” in ’The Business Journals’, May 13, 2013

”Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS” in Bloomberg, May 13, 2013

”Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process” in Reuters, May 13, 2013

”Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process ” in ’The Wall Street Journal Online’, May 13, 2013

”Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process” in MCADCafe, May 13, 2013

”Silex joins ENIAC project to develop new solutions for TSV and wafer bonding” in ’Solid State Technology’, May 13, 2013

”Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding” in ’Nanotechnology Now’, May 13, 2013

Prominent Newsletters

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December 2013